ACM Research, Inc. is a semiconductor equipment company that develops, manufactures, and sells process tools for integrated-circuit fabrication and wafer packaging. Its portfolio centers on single-wafer wet-cleaning systems designed to remove particles, contaminants, and process residues from wafer surfaces, supporting manufacturing quality across foundry, logic, memory, DRAM, and 3D NAND applications. The company also provides electrochemical plating, furnace, PECVD, track, and other front-end processing platforms, along with equipment for advanced packaging. Packaging products include coaters, developers, photoresist strippers, scrubbers, wet etchers, and copper-plating systems used in wafer assembly and interconnect formation. ACM Research, Inc. markets these solutions under product families including SAPS, TEBO, ULTRA C, ULTRA Fn, Ultra ECP, Ultra ECP ap, and Ultra Track. Headquartered in Fremont, California, the company serves semiconductor manufacturers and packaging customers in Mainland China and international markets, occupying a specialized role in the capital-equipment sector by addressing wafer cleaning, surface treatment, deposition, etching, and process-control requirements.
CEO Dr. Hui Wang Ph.D. · 2,513 employees · United States · https://www.acmr.com